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Item: | Thermal Conductive Pad | Color: | Different |
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Hardness: | 20~60 Shore C | Density: | 2.98±0.2 G/cm3 |
Thermal Conductivity: | 3.0 W/m.k | ||
High Light: | thermal adhesive tape,heat transfer adhesive tape |
Thermal Conductive Pad with Silicone for Multifarious Heat Transfer
Description
THERMAL SILICONE PAD is a high-resilience, cost-effective thermal joint filler gasket. The material itself has certain flexibility and double-sided self-adhesive. It is used to fill the gap between the heat-generating part and the heat sink or metal casing. Thermal conductivity and insulation, stable operation from -40 ° C to 200 ° C, it meet the UL94V0 flame retardant grade requirements.
Features
Thermal conductivity: 3.0W/m.k
Double-sided self-adhesive, highly conformable
High performance electrical insulation
Wide range of environmental adaptability
Application
Power module
LCD
LED
Heat sink
High speed memory storage module
Physical Characteristics | Standard Values |
Color | Different |
Hardness | 20~60 Shore C |
Density | 2.98±0.2 g/cm3 |
Tearing Strength | 0.38 KN/m |
Breakdown Voltage | ≥4 KV |
Volume Resistance | 1.1×1016 Ω.cm |
Thermal conductivity | 3.0 W/m.k |