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High Thermal Conductivity Plus S-Class Softness And Conformability Gap Pad

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Good quality Polyimide Film Tape for sales
Good quality Polyimide Film Tape for sales
I want to say that your tape is very good. Thank you for all your suggestion, after sales service is also good.

—— Mr Benjamin

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High Thermal Conductivity Plus S-Class Softness And Conformability Gap Pad

China High Thermal Conductivity Plus S-Class Softness And Conformability Gap Pad supplier
High Thermal Conductivity Plus S-Class Softness And Conformability Gap Pad supplier High Thermal Conductivity Plus S-Class Softness And Conformability Gap Pad supplier High Thermal Conductivity Plus S-Class Softness And Conformability Gap Pad supplier High Thermal Conductivity Plus S-Class Softness And Conformability Gap Pad supplier

Large Image :  High Thermal Conductivity Plus S-Class Softness And Conformability Gap Pad

Product Details:

Place of Origin: US
Brand Name: Bergquist
Certification: ROHS/UL/COC/COA/SGS
Model Number: 5000S35

Payment & Shipping Terms:

Minimum Order Quantity: 1 m2
Price: Based on Dimension and Qty
Packaging Details: Poly Bag + Strong Cartons
Delivery Time: 5-8 Working Days
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram, PayPal
Supply Ability: 10000 m2/Month
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Detailed Product Description
Item: Gap Pad 5000S35 Material: Fiberglass-Reinforced Filler And Polymer
Color: Light Green Thickness: 0.508 To 3.175 Mm
Dielectric Breakdown Voltage (Vac): >5000 Thermal Conductivity (W/m-K): 5.0

High Thermal Conductivity Plus “S-Class” Softness And Conformability Gap Pad

 

Product Description

Gap Pad 5000S35 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability. The fiberglass reinforcement provides easy handling and converting, added electrical isolation and tear resistance. The inherent natural tack on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance. The top side has reduced tack for ease of handling. Gap Pad 5000S35 is ideal for high-performance applications at low mounting pressures.

 

Features and Benefits

• High thermal conductivity: 5 W/m-K
• Highly conformable,“S-Class” softness
• Natural inherent tack reduces interfacial thermal resistance

• Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile component leads
• Fiberglass reinforced for puncture, shear and tear resistance

• Excellent thermal performance at low pressures

 

TYPICAL PROPERTIES

High Thermal Conductivity Plus S-Class Softness And Conformability Gap Pad

 

Typical Applications

• CDROM / DVD ROM
• Voltage Regulator Modules ( VRMs) and POLs
• Thermally-enhanced BGAs
• Memory packages / modules
• PC Board to chassis
• ASICs and DSPs

 

Configurations Available

Die-cut parts are available in any shape or size, separated or in sheet form

Contact Details
Kingzom Co., Limited

Contact Person: Mr. Enrique

Tel: 86-1386-0722109

Fax: 86-592-7071789

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