3M 7419 | Polyimide Film Tape | Silicone-Free | Acrylic Adhesive | Low-Static | Kapton Tape

Product Description

3M 7419 is a low-static, silicone-free polyimide (Kapton®) single-coat high-temperature tape, amber, total 1.8mil/0.046mm, with 1mil/0.025mm DuPont Kapton film and a specialty non-silicone acrylic PSA; standard roll 33m/36yd on a polyethylene core. It is made for PCB solder masking and other high-heat steps—wave/solder-reflow protection of pads, gold fingers, through-holes and connectors. After 10min at 260°C/500°F it can still remove cleanly with little/no residue from FR-4, gold, copper and silicon; the silicone-free acrylic reduces contamination that would hurt later bonding/conformal coating, while static-dissipative behavior suits ESD-sensitive lines, plus demanding chemical and powder-coat masking.

Structure

Features

• Silicone-free acrylic, no contamination: replaces silicone PI (e.g. 5413/7413 families) for solder mask without silicone-oil migration; safer for later soldering, wire bonding, underfill and conformal coating.
• Low-static dissipative: unwind/removal static ＜100V, surface resistance 5×10⁶Ω/sq; less ESD risk than standard silicone PI in SMT/semiconductor/HD/optoelectronics lines.
• Clean removal after 260°C short bake: Kapton plus specialty acrylic holds on copper/FR-4/gold/silicon for 10min at 260°C/500°F and removes with little/no stain/residue; far hotter than crepe/UPVC/PET and more post-solder clean than some acrylic PI.
• Dimensional-stable, insulating PI: 0.046mm film resists solder heat shrinkage/scorch, dielectric 6000V, masks fine pads/gold fingers without edge collapse; thinner/cleaner than paper/cloth high-temp, more planar than thick foam.
• Chemical-resistant demanding mask: specialty high-temp acrylic suits etch/clean/powder-coat high-temp mask better than commodity acrylic film; silicone-free also reduces powder-cure silicone spots.
• Amber semi-transparent for alignment: see traces/gold fingers/legend edges during PCB apply; more precise than opaque foil/cloth, hotter than clear PET.
• Linerless standard / linered conversion: 7419 linerless for hand/dispenser; 7419L PET liner for gold-finger shapes, hole masks and auto placement with clean die-cut waste; easier conversion than linerless silicone PI.
• Controlled tack curve on smooth faces: moderate steel/copper initial, stronger at 72h, high at 260°C/10min yet defined clean-removable; better for residue-sensitive rework than “hotter=tighter” silicone PI.

Applications

• PCB wave/reflow solder mask: pads, gold fingers, through-holes, BGA edges and connector pins before wave/reflow/selective solder; low dross/residue after strip.
• Gold-finger/plated-gold protection: DIMM slots, connectors, gold contacts and key gold surfaces during high-temp steps—silicone-free and low-static for sensitive gold.
• Residue-sensitive electronic substrates: FR-4, copper foil, silicon, ceramic and solder-mask temporary cover where later bonding/dispensing/conformal coating needs zero silicone.
• SMT/semiconductor ESD-sensitive: surrounding SMD high-temp mask, wafer/package temporary hold, lead-frame small-part protection with low unwind static.
• Chemical/etch and powder high-temp mask: cleaning, micro-etch, short chemical exposure and powder-coat cure masking with acrylic chemical resistance plus no silicone.
• HDD/optics/sensors: head assemblies, lens barrels and optical-window jig cover with low static and no silicone to cut particles/oil risk.
• Die-cut shaped masks: 7419L or converted gold-finger shapes, hole dots, narrow trace masks and feeder strips with PET liner for auto placement.
• Temporary high-temp electrical insulation: thin PI insulation sleeves, coil terminals and test-fixture hot faces (not as primary rated insulation; confirm electrical spec).