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|Name:||3M 8805/8810/8815/8820||Color:||White Tape And Blue Liner|
|Adhesive:||Acrylic||Thickness:||0.125mm/ 0.25mm/ 0.375mm/ 0.50mm|
|Material:||Filled Acrylic Polymer Tape||Filler Type:||Ceramic|
fire resistant tape,
high temp foam tape
3M 8805/8810/8815/8820 Thermally Conductive Adhesive Transfer Tapes, Same Features Equivalent Tape
3M Transfer Tape 8805 8810 8815 8820 thermal conductive tape are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes).
3M Transfer Tape 8805 8810 8815 8820 are tacky pressure sensitive adhesives loaded with thermally conductive ceramic fillers that do not require a heat cure cycle to form an excellent bond to many substrates. Only pressure is needed to form an excellent bond and thermal interface.
1. Excellent thermal stability of the base polymer
2. Thermally conductive tapes are provided on a silicone treated polyester release liner Excellent adhesive performance with good wetting and flow onto many substrate surfaces
3. Tapes are tacky pressure sensitive adhesives loaded with thermally conductive ceramic fillers that do not require a heat cure cycle to form an excellent bond to many substrates
4. High mechanical strength
5. Improved surface wet-out for rough surface/LSE substrates
6. Excellent shock performance
7. Halogen free
8. Ideal for thin bonding applications
9. Good thermal transfer
1.For rigid to rigid bonding, a twisting motion during assembly of the substrates will improve wetting. This should be a back and forth twisting motion during the application of compression.
2.For flexible to rigid or flexible to flexible bonding, a roll lamination system may be employed to apply the flexible substrate down to the rigid (or other flexible) substrate. Rubber nip rollers, heated steel rollers, and other methods can be employed to bond in a continuous manner.
3.Heat can be employed to increase wetting percentage and wetting rate of the substrates and to build room temperature bond strength.
4.Primers may be employed to increase adhesion to low surface energy substrates (eg. plastic packages).
5.For best product performance, it is important to use pressure and time conditions to achieve as much wetting as possible.